# Photonic integrated circuit packaging service for 8 PICs. Includes wore bonding to PCB, fiber alignment and bonding of FAUs and associated process development and engineering costs.

Federal contract opportunity, via Kontrakk.

- **Agency:** NATIONAL AERONAUTICS AND SPACE ADMINISTRATION.NATIONAL AERONAUTICS AND SPACE ADMINISTRATION.NASA SHARED SERVICES CENTER
- **Notice ID:** 9517449fa10b4afd8b72b245d5a29ed8
- **Solicitation number:** 80NSSC26939631Q
- **Notice type:** Special Notice
- **NAICS:** 813920
- **Contracting office location:** Stennis Space Center, MS
- **Posted:** August 10, 2026
- **Response deadline:** August 12, 2026
- **View on Kontrakk:** https://kontrakk.com/contracts/9517449fa10b4afd8b72b245d5a29ed8
- **View on SAM.gov:** https://sam.gov/workspace/contract/opp/9517449fa10b4afd8b72b245d5a29ed8/view

## Description

Full description available on SAM.gov: https://sam.gov/workspace/contract/opp/9517449fa10b4afd8b72b245d5a29ed8/view

## Points of contact

- kacey Hickman · kacey.l.hickman@nasa.gov (primary)
- Will Garrett · will.c.garrett@nasa.gov (secondary)