# PCB FABRICATION AND ASSEMBLY OF HPSC PROCESSOR CARD

Federal contract opportunity, via Kontrakk.

- **Agency:** NATIONAL AERONAUTICS AND SPACE ADMINISTRATION.NATIONAL AERONAUTICS AND SPACE ADMINISTRATION.NASA SHARED SERVICES CENTER
- **Notice ID:** daa3b7bbaedc4bcaa3e05c6f5594404c
- **Solicitation number:** 80NSSC26939777Q
- **Notice type:** Special Notice
- **NAICS:** 334418
- **Contracting office location:** Stennis Space Center, MS
- **Posted:** July 27, 2026
- **Response deadline:** July 29, 2026
- **View on Kontrakk:** https://kontrakk.com/contracts/daa3b7bbaedc4bcaa3e05c6f5594404c
- **View on SAM.gov:** https://sam.gov/workspace/contract/opp/daa3b7bbaedc4bcaa3e05c6f5594404c/view

## Description

Full description available on SAM.gov: https://sam.gov/workspace/contract/opp/daa3b7bbaedc4bcaa3e05c6f5594404c/view

## Points of contact

- Cody Guidry · cody.d.guidry@nasa.gov (primary)
- Tiffany Neal · tiffany.neal@nasa.gov (secondary)